Everyone already knows that the AMD Ryzen 7 5800X3D processor will be the only Zen3 model with 3D V-cache, for which AMD has its own reasons, and it is likely that they are problems with TSMC.
According to colleagues from DigiTimes, TSMC’s 3D SoIC technology has not yet reached true mass production, and in fact it is used not only for Ryzen 7 5800X3D, but also for EPYC Milan-X. Moreover, it is important to note that the latter need not one stack of 3D V-cache, but several at once (the flagship EPYC 7773X needs as many as 8). That is why, as stated, AMD decided to release only one model of custom processors with this technology.
However, there is still hope as TSMC is building another factory in Chunan. This factory should start working by the end of 2022, and therefore at the same time it will be possible to wait for the increase in production capacity of TSMC 3D SoIC for upcoming Zen 4 processors and other solutions.
As for the AMD Ryzen 7 5800X3D, we are promised up to a 15% increase in gaming performance, 96 MB L3 cache, full compatibility with existing AM4 motherboards, and an identical “stone” TDP to the regular Ryzen 7 5800X.