A total of $44 billion will be spent this year for similar purposes.
After lengthy negotiations and preparations, TSMC this year began construction of a facility in Arizona, which will begin manufacturing 5nm products for local and international customers after commissioning in 2024. How did it become known this week, TSMC issued $3.5 billion worth of bonds to finance the construction of the facility.
Image Source: TSMC
The total costs should reach $ 12 billion, and the company would very much like to cover part of them with subsidies from the US authorities, but they are not in a hurry to approve an appropriate program to support the national semiconductor industry.
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The Japanese company TSMC is financed by about 15% by shareholders represented by Sony and Denso, and in general, participants in the Japanese project would like to cover half of the costs with a total cost of about $ 7 billion through government subsidies. However, their size has not yet been determined, and therefore the main financial burden still lies with TSMC. At the quarterly reporting conference last week, the head of the company said that he was not going to reduce the amount of capital expenditures for this year, which will reach $44 billion.