Samsung introduces stacked GDDR6W memory: double the capacity and bandwidth

Samsung has introduced a new type of memory for video cards. With GDDR6W, the memory chips are stacked, which not only gives twice the capacity per memory package, but also twice the bandwidth. With the so-called FOWLP (Fan-Out Wafer-Level Packaging) technology, memory chips are placed directly on a wafer, instead of on a PCB. A memory package is therefore thinner even after stacking than with GDDR6: 0.7 mm compared to 1.1 mm. GDDR6 vs. GDDR6W. It ha…