December 4th, 2022 at 4:15 p.m. by Maximilian Hohm – As part of the IEDM, Intel wants to give some insights into the current research on trillion transistor chips. These should be possible from 2030 and succeed through technologies such as denser 3D packaging with chiplets and new materials that are only as thick as three atoms. Therefore, read more about Intel’s plans and what should happen in the context of the IEDM below.
Intel has or will present new findings in 3D packaging technologies at the International Electron Devices Meeting (IEDM), which should help the manufacturer to accommodate more transistors in computer chips in the future. The aim is to achieve up to ten times the packing density. New materials are also being used that are only three atoms thick and go well beyond RibbonFET. Intel expects more energy efficiency and storage capacity from this with limited space for high-performance computing.
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Gary Patton, Intel’s department head for research and design, referred above all to Moore’s Law and emphasized the increasing importance of computing power in the computing area, which should also be increased in the future. Intel is there to meet the “infinite demand for computing power” while continuing to increase computing power in the future.
Intel 2D Manufacturing Materials Source: Intel via Videocardz
As part of the 75th birthday of the transistor, Dr. Ann Kelleher, Head of Technical Development, presenting future developments and processes of industrial innovation. It is about different ecosystems, the growing demand for computing power and which strategies Intel uses to be particularly innovative and to comply with Moore’s Law.
The most important of these technologies are 3D packaging, in which a scalable architecture can be achieved primarily through chiplets and their simple integration, the new 2D materials, which, thanks to their reduced thickness, enable more transistors per chip and thus new possibilities in terms of energy efficiency and can achieve storage density. The company’s declared goal is to develop a package with one trillion transistors by 2030 and thereby maximize computing power.
Those: Intel via Videocardz