Most likely, the region will remain catching up, if we talk about lithography.
The DigiTimes edition today became generous in providing free access to the audience to a rather informative material devoted to assessing the prospects for the implementation of the global semiconductor industry development program, which can be conditionally dubbed the “Gelsinger Plan” in honor of the Intel CEO who proposed it. In his opinion, by the beginning of the next decade, the United States and Europe together will produce 50% of all semiconductor components in the world, while Asia will be content with the remaining 50% instead of the current 80%.
Image Source: GlobalFoundries
It is difficult to doubt that the US authorities and local companies have ambitions to develop the national semiconductor industry. Asia is also in no hurry to give up its positions – just take into account the latest statements by the management of TSMC, which is going to master the production of 2-nm chips at Taiwanese enterprises. Even Japan is actively cooperating in this area with both the United States and Taiwan, hoping to learn how to produce those same 2-nm chips on its territory by 2027.
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The palest of all, according to the authors of the publication on the pages of DigiTimes, Europe looks in this company. Without serious measures to stimulate the development of local chip production and development, the region will not be able to achieve the desired level of development. The appearance of TSMC and Intel enterprises in Germany will not solve all the problems, since the first will focus on mature technical processes, and the second will deal with testing and packaging of chips, although the component crystals themselves will have to be brought from other countries.