The Japanese company Dai Nippon Printing (DNP) has developed the Glass Core Substrate (GCS), a glass-core substrate designed for the assembly of semiconductor chips. The new substrate makes it possible to place contacts more densely than textolite substrates commonly used today. This is especially true now, when more and more crystals are placed on the same substrate – the new solution should be the best suited for these purposes.
A new type of substrate from DNP is designed to replace conventional polymer substrates, which now house the crystals of the vast majority of central and graphic processors, as well as many other microcircuits. Glass Core Substrate utilizes High Density Through Glass Channels (TGV) to provide a higher density of conductive channels than traditional current solutions.
The new substrate is a glass sheet with many tiny through holes, on the walls of which a layer of metal is deposited. Through them, the terminals of the semiconductor crystal are connected to the contacts that go directly to the motherboard. The manufacturer notes that the Glass Core Substrate uses a patented technology for more reliable adhesion of the glass base and metal, which was difficult to achieve using traditional chip assembly methods.
The company also points out that the new substrate is scalable and can be used to manufacture chips of various configurations and performance, including those with very large substrates. To ensure high-quality transmission of large volumes of signals and high density in a limited space, the substrate must have a high ratio of glass thickness to via diameter (the higher the ratio, the more difficult it is to process). The DNP glass substrate has a high aspect ratio of 9+ and has sufficient adhesive properties for fine electrical wiring.
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