In a press release, Intel talked about PowerVia processor power technology. It will make the chips more economical and compact. In accordance with the new method, the power rails are moved to the bottom of the processor and it is supplied directly to the components that require it. This eliminates the need for side feed lines.
The VLSI 2023 account tweeted photos from an Intel article dated June 2, one of which was taken with a thermal imager:
#VLSI2023 Highlight paper T1-1 “E-Core Implementation in Intel 4 with PowerVia (Backside Power) Technology” – Intel Corp.
Intel reports a high-yielding backside power delivery technology, PowerVia Technology*, and Intel E-Core Implementation in PowerVia Technology. pic.twitter.com/0us9rbUvQr— IEEE Symposium on VLSI Technology and Circuits (@VLSI_2023) May 2, 2023
During the development of processors, the lines of force have become an “increasingly chaotic web.” The need for their location increased the processor area and reduced the bandwidth of the power buses. The effectiveness of the new principle has already been proven on the Blue Sky Creek experimental chip, based on the energy-efficient core of the forthcoming Meteor Lake processor. Intel claims to have improved not only the power system, but also signaling.
PowerVia-based solutions are expected to enter production in 2024. The company expects the new technology to help it regain lost ground in technology competition with AMD and TSMC.
Intel has completed the development of process technologies 18A and 20A. Chips 1.8 nm and 2 nm will appear in 2024
Source: The Verge
