In the fourth quarter of this year, TSMC’s new plant in Japan will begin mass production of semiconductors using process technologies from 28 nm to 12 nm. According to official statisticsthe total number of investment projects in the field of semiconductors implemented on the territory of Kyushu Island from April 2021 to June 2024 reached 100, and the amount of investments attracted reached $32 billion.
Image source: Micron Technology
As is known, TSMC and its Japanese partners Sony and Denso are planning to build at least two joint ventures in total on the island of Kyushu in Kumamoto Prefecture. These two projects alone accounted for more than 60% of the investment volume directed to the region since April 2021. Of the hundreds of investment projects, details of the investment amounts are available for 72. In Kumamoto Prefecture, 52 projects are being implemented in total, with Fukuoka Prefecture in second place with 15 projects. Not only TSMC contractors and partners are building their plants on Kyushu Island, but also independent companies. At least the power electronics manufacturer Rohm intends to invest about $1.9 billion in the construction of its plant in Miyazaki Prefecture.
In total, about $20 billion will be invested in the construction of two TSMC plants in Japan, of which the country’s authorities will compensate about $7.7 billion in subsidies, which is quite a lot by the standards of the global industry, and unprecedentedly generous for Japanese projects. Sony began construction of its image sensor plant in Kumamoto in April, since it is participating in the capital of the joint venture with TSMC specifically for the access to the ability to produce the corresponding components. Silicon wafer supplier Sumco is allocating $2.6 billion for the implementation of related projects, not only expanding its existing plants on the island of Kyushu, but also intending to build a new one.
TSMC’s first facility on the island will be able to produce up to 55,000 wafers per month, using 28, 22, 16 and 12 nm process technology. The second facility will begin construction later this year and will be completed by the end of 2027, producing 7 nm and 6 nm products. Together, the two facilities will be able to process 100,000 wafers per month.
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