TSMC and Intel will be able to use its services.
As of 2019, the United States packaged only 2% of all chips produced in the world on its territory, while China controlled 38% of the market for such services. As noted by BloombergAmkor Technology has decided to build the largest chip packaging plant in Arizona by 2027, spending $2 billion on it, part of which it will be able to recoup through government subsidies under the so-called “CHIP Act,” adopted in the United States at the end of 2022.
Image source: Amkor Technology
In total, the country’s authorities will allocate $600 million to Amkor, two-thirds of which will not need to be repaid, and $200 million will be preferential loans. In addition, the company will be able to apply for tax deductions in the amount of 25% of capital costs. The enterprise will create about 2,000 new jobs, it will be able to service the nearby Intel and TSMC factories. It is expected that Amkor will be the one to pack chips for Apple, the crystals of which will be manufactured at TSMC’s Arizona factories. The mentioned Amkor enterprise will be the largest in the United States and the first in the country in the history of this company.
