The day before, it became known that Intel was planning to abandon the construction of a research center in France and a chip packaging plant in Italy. At the same time, it was reported that there might be a delay in launching the plant in Germany. The publication recently German wave said construction of rival TSMC’s plant in Dresden would begin within weeks.
Image source: TSMC
TSMC was initially expected to begin construction of the Dresden facility in the fourth quarter, but if the next few weeks are in play, the process could begin as early as the third quarter. TSMC’s German facility is expected to be completed by the end of 2027, allowing the company to begin production there shortly thereafter.
In the European joint venture that will operate the Dresden production site, TSMC will hold 70% of the capital, with Bosch, Infineon and NXP holding 10% each. The EU and German governments will collectively cover up to half of the investors’ costs for the construction of the facility. The Dresden municipal government will spend 250 million euros to upgrade the water and electricity systems at the TSMC site.
At the future German plant, TSMC intends to produce 28-nm and 22-nm chips with a planar layout, as well as products with a FinFET transistor layout, using more advanced technological standards of 16 and 12 nm. The monthly output volume of products can reach 40,000 silicon wafers of a size of 300 mm. Intel will not begin building its plant in Germany before May next year, as reported by local media.
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