SK hynix reportedwhich will launch mass production of its next-generation GDDR7 graphics memory by the end of the current quarter. The company has been developing the new memory amid growing demand for AI components from customers around the world.
Image source: skhynix.com
The first GDDR7 chips from SK hynix will offer an operating speed of 32 Gbps per contact, which is 60% higher than the previous generation GDDR6 memory. In the future, the company plans to achieve an increase in speed to 40 Gbps from GDDR7 chips. Memory subsystems of high-performance graphics cards on the new chips will be able to provide a total throughput of more than 1.5 TB/s.
The next-generation memory is more than 50% more energy efficient, the manufacturer claims, thanks to new packaging technology that helps address the problem of heat buildup during fast data processing. The number of layers of heat-dissipating substrates has been increased from four to six, and the epoxy molding compound (EMC) in the packaging has helped reduce thermal resistance by 74% compared to the previous generation – while the chip size has not changed, making it easier to deploy.
Sangkwon Lee, head of DRAM product planning and implementation at SK hynix, said GDDR7 will be used in a wide range of applications, including 3D graphics, AI, high-performance computing, and autonomous driving. “We will continue to work to enhance our status as the most trusted memory solution provider for AI by strengthening our premium memory lineup,” Lee said.
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