Intel’s recent quarterly earnings call highlighted other issues at the company, but management had previously made it clear that the company was willing to package chips for third-party customers. Taiwanese media now they reportthat in the conditions of a shortage of TSMC’s specialized capacities, Nvidia is looking at the possibility of cooperation with Intel.
Image source: Nvidia
In May last year, we recall, Nvidia founder Jensen Huang praised Intel’s modern technological processes, and talk about the possibility of cooperation between the companies began a year earlier. However, new rumors indicate Nvidia’s interest in Intel’s services specifically in the field of chip packaging using advanced methods. TSMC has a monopoly on the use of CoWoS packaging, which is needed to produce Nvidia’s current generation of computing accelerators, but technologically this method is very close to those used by Intel. Accordingly, sources believe that after some adaptation, Intel could set up packaging and testing of Nvidia chips for computing accelerators.
In general, Qualcomm, Microsoft, Cisco and AWS (Amazon) are showing interest in such services from Intel. Intel representatives have repeatedly said that in this area, contracts with customers begin to generate revenue much faster than in the area of processing silicon wafers, so the processor giant is very interested in developing this line of business. According to rumors, Intel has already received an order from Microsoft for the production of chips using Intel 18A technology worth $15 billion.
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