Intel’s advanced chip packaging services attract the attention of Broadcom, MediaTek, and Meta✴

Intel representatives have repeatedly said that in the contract manufacturing world, its chip packaging services can start generating profits faster than processing silicon wafers. With this in mind, it’s worth noting that the number of customers interested in Intel’s core services is steadily growing; these already include Broadcom, MediaTek and Meta✴ platform.

Image source: Intel

At least, this is the list that Korean media represented by Source insists North Korea Business. Rival TSMC’s production capacity is at full capacity and set aside for the next few years, allowing Intel to assert itself more aggressively in this segment. In many ways, the implementation of EMIB wafer packaging technology can be considered a market-demand replacement for CoWoS, such as that implemented by TSMC. Using profiling technology, Intel can combine components on a single wafer with an overall size that is nine times larger than the size of the photomask used to make single-die crystals. The combined chip area using EMIB packaging can reach 120×120mm.

The EMIB-T package version adds inter-layer connections to optimize power distribution within the chip and reduce the distance that signals travel, which should be useful to developers of complex AI chips. According to reports, Google and Broadcom, which helped it develop TPU chips, have become interested in EMIB-T packaging. MediaTek and Meta are also paying attention to Intel’s technical capabilities in this area.✴. As company representatives expect, core services will begin generating a significant portion of Intel’s contract revenue starting in the second half of next year.