TSMC has traditionally built cutting-edge chip production plants primarily in its native Taiwan. The technology park in Taichung will be ready to house four factories for the production of 1.4 nm wafers, the first of which will be ready in April 2027 and will start volume production in the second half of the same year, although initially this was not supposed to happen until 2028 because Report Taiwan source.
Image source: TSMC
Construction of the P1 plant, which is part of the complex, is already in full swing and by April next year it will start producing 1.4nm products. The foundations for a second P2 facility are also under construction and are expected to be completed in October 2027.
The P3 and P4 factories will also be located here. The construction permit for the first project has been received and the necessary approvals for the P4 project are in progress. By the end of 2028, TSMC’s four factories producing 1.4nm wafers will all be put into production in Taichung. If P3 is completed in the second quarter, then P4 will not be ready until the fourth quarter of 2028. The complex of four businesses will be able to generate at least $16 billion in revenue annually.
Taichung Technology Park has long attracted TSMC partners and suppliers; they locate representative offices and production facilities within its borders. Taiwan, with its developed supplier ecosystem, can provide short production times and reasonable prices for production services for new generation chips. It is rumored that TSMC is also considering acquiring AUO’s factory near Taichung’s Fab 15 factory to mass-produce integrated optoelectronic components there.
Rivals Intel and Samsung Electronics plan to launch 1.4nm chips in 2028 and 2029 respectively. If these assumptions are correct, TSMC will be ranked first and Samsung will be ranked last in terms of the speed of development of the process.
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