Samsung and Qualcomm have developed a new type of processor that uses organic materials borrowed from printed circuit boards to integrate multiple layers of wafers, rather than silicon or its alternatives. Organic bridge technology is suitable for semiconductors in artificial intelligence systems.
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2.1D packaging will help reduce the production cost of artificial intelligence chips, while artificial intelligence chips usually use 2.5D packaging. 2.5D wafers typically use silicon, glass or ceramic as connections between wafer layers; however, 2.1D technology involves the use of organic materials to increase yields. This technology borrows from the field of self-printed circuit board technology, which can reduce production costs while speeding up assembly.
Organic bridges are not components made of silicon or its inorganic substitutes, but layers made of resins or polymers. It is designed to connect multiple dies of a die while providing isolation similar to silicon designs. Developers have proven that organic bridges are more efficient and easier to produce in large quantities. The technology could also help solve silicon-related supply chain issues. Development may begin in October 2024, when a corresponding patent application is filed.
Data centers with massive computing equipment are being built around the world, and 2.1D packaging technology can make a significant contribution to the development of the AI industry. Samsung is not only working with Qualcomm to develop organic bridge technology; other companies have also expressed interest in developing 2.1D packaging chips. Intel and TSMC have similar solutions in various stages of preparation.
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