Stellar Blade: Unsightly logos on the packaging – developers also think about collectors
Shortly before the release of the action title, the developers at Shift Up revealed a small ...
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Tag: packaging
Nvidia Blackwell Entry Will Increase Demand for TSMC's Advanced CoWoS Chip Packaging by More than 150% in 2024
This year, Nvidia will release a family of next-generation Blackwell compute accelerators, which will include solutions ...
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Aroged: SK hynix expects to launch memory testing and packaging in the USA by 2028
$4 billion will be spent on construction of the plant in Indiana. The Wall Street Journal ...
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Samsung aims to earn $100 million from chip packaging this year
The demand for services for assembling chips from several dissimilar crystals is pushing contract manufacturers to ...
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Aroged: TSMC will continue to build chip packaging plants in Taiwan
Because at the current rate of evolution of NVIDIA accelerators, there will be a catastrophic lack ...
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TSMC is thinking about building a chip testing and packaging facility in Japan
It has long been known that one of the reasons for the current shortage of advanced ...
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Aroged: Intel will refrain from building an advanced chip packaging plant in Italy
For undefined period. Intel has technically had manufacturing capabilities in Europe for decades, with facilities in ...
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Aroged: Samsung decided to follow the example of SK hynix in the field of packaging technologies for HBM memory chips
You have to catch up with the leader. According to analysts surveyed by Reuters, this year ...
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Aroged: US Secretary of Commerce calls for doubling the number of chip packaging plants in the Philippines
The country will become a priority area of expansion for American companies. Attending a business forum ...
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Stellar Blade: Minimum weight in GB for installation has been revealed by the packaging
Stellar Blade it's still a long way off but in Japan the physical video game retail ...
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