The company announced plans for future production at the Intel Foundry Direct Connect event. The corporation is actively increasing chip production and is systematically moving towards the development of new technological processes. Let us remind you that the company has switched to its own name for the technical processes. Now the company has already launched test production based on Intel 20A (20 angstroms) and Intel 18A (18 angstroms), introducing new backside power technologies (PowerVIA) and GAA transistors (RibbonFET). Further plans include the development and launch of Intel 14A and Intel 10A.
The 14A process technology is similar to 1.4 nm. Intel will launch production of chips using this technology in 2026. And by the end of 2027, it is planned to start production of chips based on Intel 10A (1 nm). And each new technological process should provide a double-digit increase in productivity at the level of 14-15%. As Intel masters advanced EUV lithography techniques, it will gradually phase out 14nm, 10nm and Intel 7.
The company is also actively expanding packaging capabilities based on Foveros, EMIB, SIP (silicon photonics) and HBI (hybrid interconnect) technologies to produce high-power, complex chips. This is true for high-performance AI chips that combine a processor and HBM memory on a single substrate.
Intel's rapid progress in this direction is supported by large investments and contract manufacturing of chips for third-party customers. Over the next five years, the company wants to attract $100 billion in investment to expand and create new production facilities. But the pace of launching new product lines also depends on US government subsidies through the Chips and Science (CHIPS) Act. At the same time, the company's production infrastructure includes enterprises around the world.
Source:
Tom’s Hardware