The clock frequencies of modern DDR5 RAM continue to increase and with it the waste heat that is generated and ultimately dissipated. ADATA would like to make the memory modules in its XPG Lancer and XPG Lancer Neon series work significantly cooler, even at 8,000 MT/s+, thanks to a new coating.
PCB receives a special thermal coating
In addition to the voluminous heat spreader, ADATA would now like to find a new way to significantly reduce the waste heat from its memory modules (“ICs”) or to dissipate it better and faster. For this purpose, the circuit board, the so-called PCB (“Printed Circuit Board”), undergoes a special treatment and is provided with a coating (“thermal coating”) for the first time. This should reduce temperatures by an average of 10.8 percent, according to ADATA.
Source: ADATA ADATA considers the new coating process, which is initially used exclusively on memory modules from the gaming division XPG (“Xtreme Performance Gear”), to be so revolutionary that it has even become the “industry standard” for particularly highly overclocked DDR5 RAM with 8,000 MT/s+ could develop.
Premiere at Computex 2024
The new DDR5 memory kits of the XPG Lancer, Lancer RGB and Lancer Neon series are scheduled to celebrate their premiere at Computex 2024, which will take place from June 4th to 7th, 2024 in Taipei. All models should support Intel XMP (“Xtreme Memory Profile”) 3.0 and AMD EXPO (“Extended Profiles for Overclocking”).
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Those: NEEDLE