TSMC may double CoWoS production capacity in the next two years. This technology is critical for packaging modern I accelerators, and its shortage has forced manufacturers to find alternatives.
According to Taiwanese analysts, TSMC’s CoWoS production capacity may increase to 260,000 12-inch wafers per month by the end of 2028, compared with approximately 130,000 wafers by the end of 2026. The main focus will be on the company’s plants in Arizona and its AP7 plant in Taiwan. Currently, advanced chips made in the United States must be sent to the island for packaging, as CoWoS’s main facilities are concentrated there.
Amid packaging capacity shortages, competitors are increasingly receiving attention, including Intel’s EMIB-T technology. It is significantly different from CoWoS and uses special bridges within the organic substrate instead of a silicon interposer. Analysts estimate that Intel CoWoS equivalent production capacity may reach 15-20,000 wafers per month by 2027, growing to 40-45,000 wafers a year later.
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