Xiaomi showed off the AI Cube, an unusual mini PC prototype built on three different chips of its own design: the Xring O3 single-chip mobile platform, the Xring O100 artificial intelligence accelerator and the Xring D100 automotive artificial intelligence processor. According to Xiaomi, the system is rated to consume 150 W. This mini computer features an all-metal aluminum body with 33,874 CNC machined holes for better heat dissipation.
Image source: Xiaomi
Xring O3 includes 10-core CPU, 16-core G2-Ultra NX GPU and 200 TOPS neural processor. This chip is the first mobile processor to support LPDDR6 memory.
In the Xring O100 artificial intelligence accelerator, the company used a 6-nanometer logic layer and a neural processor layer, as well as two high-speed DRAM layers, vertically stacked together using wafer-to-wafer technology. Hybrid bonding technology shortens the bonding pitch to 1.4 microns, and face-to-face metal bonding shortens the distance between DRAM and computing layers. Xiaomi claims throughput up to 1.22 TB/s.
Xring D100 is a 3nm Xiaomi artificial intelligence control chip. It combines a 20-core processor with a 16-core neural processor and supports up to 160GB of unified memory. The D100 can support a local model with 200 billion parameters, but configurations of 12 billion and 3 billion parameters were specified during the AI Cube demonstration.
The O100 and D100 chips are scheduled to be released for sale in 2027, and the release date and price of the AI Cube are not yet known.
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