Just a year ago, Intel wasn’t entirely sure it was feasible to master 14A angstrom process technology, but last month it changed its tune. Now the company even claims that the dynamics of reducing defect density in the case of Intel 14A exceed the performance of all technological processes it has mastered since 22nm technology.
Image source: Intel
At least that’s what Intel CFO David Zinsner said at the recent Deutsche Bank Technology Conference. resource ComputerBase.de I never tire of reminding you that 22nm process technology was once very important to the company, but difficult to master, if only because of the introduction of FinFET transistor structures within its framework. However, this milestone in Intel’s history also came with subsequent critical failures. Since the 10nm process failed from the beginning, Intel had to do its best to “extend the youth” of the more mature 14nm process.
Even with the relatively successful 22nm process technology, Intel has to bring the Ivy Bridge processors based on it to the E1 step to achieve satisfactory quality to supply the market. In contrast, 32nm Lynnfield processors initially came to market with B1 steps, while Nehalem only had to alphabetically reach C0 steps. The thinner the technical standards for chip production, the harder it is to master, and in this sense, Intel 14A represents a high-risk combination, otherwise the company would not have considered abandoning its development last year.
The toolkit for chip designers who want to commission Intel to manufacture its 14A technology will be moved this October to version 0.9, which is actually suitable for creating the first physical samples. The company plans to start trial production of chips using Intel’s 14A technology next year and begin mass production in 2028. Zinsner acknowledged that the company is already working hard to develop facilities for mass production of such chips. First, the new Fab 62 facility in Arizona will make this possible. Secondly, the experimental line in Oregon currently uses Intel 18A-P technology to produce chips and will be converted to use 14A technology to produce chips. After reorganizing this production line, Intel will mass-produce 14A technology products in Oregon. In addition, the first phase of the company’s new Ohio factory, which was previously forced to freeze, will be used to produce such wafers. Starting in late 2027, Intel customers will also have access to wafer packaging services using advanced EMIB-T layouts. Around the same time, they will be able to receive chips produced to order from Intel using 14A technology.
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