
Intel found itself in a 14A timing mess. It was initially reported that CEO Lip-Bu Tan expected to start production using 14a technology in the first quarter of 2027, but the company has now confirmed a different date – early 2028.
The Economic Daily initially quoted Intel CEO Chen Liwu as saying that production of 14A technology would begin in the first quarter of 2027. This means that the construction schedule has been accelerated again after being previously postponed from 2028 to the second half of 2027. However, Intel later clarified the news: 14A technology will begin mass production in the first quarter of 2028, which corresponds to the plan announced by the company in the second quarter of 2020 report. 2026.
At the same time, the development of the technology process itself is moving really fast. In June 2026, the defect density of 14A is estimated to be about 0.5, and Intel expects to reduce this number to 0.1-0.2 by the first quarter of 2027. The fewer defects there are on a wafer, the higher the potential yield of usable wafers.
14A belongs to the 1.4nm process level and uses RibbonFET 2 transistors, second-generation GAA architecture and PowerDirect rear power supply. Jeff Pu, an analyst at GF Securities, said that silicon wafer production will reach 6,000 wafers per month in 2027 and 24,000 wafers per month in 2028. At the same time, it was previously reported that the yield rate of 18A suitable crystals has reached about 80%.
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