ADATA has introduced a new coating for high-speed memory modules that will reduce their temperature. It will appear for the first time in DDR5-8000 modules produced under the XPG brand. According to the manufacturer, this coating can reduce the operating temperature of memory chips by 10%. In practice, this means a temperature reduction of approximately 8.5 degrees Celsius.
“XPG overclockable memory modules use a new thermal coating technology that effectively reduces their operating temperature by 10%. (…) Real-world tests show an 8.5 degree Celsius reduction in temperature for overclocked DDR5 RAM modules with PCB heat dissipation technology compared to standard overclocked memory, as well as an increased heat dissipation efficiency of 10.8%,” the press release states. ADATA release.
The coating provides additional area for heat dissipation and, in combination with the heatsink, provides more efficient cooling of the memory modules. ADATA plans to use this technology in its fastest RAM modules with data transfer rates of 8000 MT/s and higher.
The manufacturer provided an image showing the operation of the new thermal coating on a memory module without an installed heatsink against the background of the same RAM module without a heatsink and a new coating. The company did not specify the speed of the memory module.
The manufacturer's press release states that the first RAM modules with the new thermal coating will go on sale in the second quarter of this year. Closer to the Computex 2024 exhibition, which will take place this summer, the company will present memory modules from the LANCER NEON RGB and LANCER RGB series with the same thermal coating.
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