The diversity of Samsung Electronics’ business has both advantages and disadvantages for the company. For example, it can independently produce all crystals for HBM-level memory stacks, while rival SK Hynix is forced to order basic crystals from TSMC. As part of HBM4E production, the cooperation scheme may change as Intel will also start producing base crystals for SK Hynix.
Image source: Unsplash, Brecht Corbeel
At least, that’s the scenario the Korean publication insists on. korea herald. At the same time, the interaction between SK Hynix and TSMC will not stop; the latter will have the second basic crystal supplier for the HBM4E stack. This diversification should allow SK hynix to increase the reliability of its supply to customers in the face of supply chain shortages and geopolitical risks.
As part of the production of HBM4 stacked crystals, SK Hynix turned to Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) for the production of base crystals, which uses 12 nm technology for production. This generation’s base memory chips are estimated to be three to four times more expensive than the DRAM chips that make up the bulk of the stack. In addition to this, the presence of two contractors in this area will allow SK Hynix to slightly improve the price conditions for basic crystal production services – especially since Intel is interested in growing its contract business and attracting new customers.
Memory maker SK hynix is also eyeing Intel’s EMIB packaging technology and TSMC’s CoWoS-S and CoWoS-L products. It is worth mentioning that the former CEO of SK Hynix also worked for Intel. This will certainly help strengthen the business ties between the current and former employer. As early as June, SK Hynix began shipping samples of the 12-layer HBM4E stack. The cooperation plan with Intel has not yet been approved and is currently only under hypothetical consideration.
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